Laser Cutting Methods

Lasercutting

Laser cutting is a technology that uses a laser to cut materials, and is typically used for industrial manufacturing applications, but is also starting to be used by schools, small businesses, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC (computer numerical control) are used to direct the material or the laser beam generated. A typical commercial laser for cutting materials would involve a motion control system to follow a CNC or G-code of the pattern to be cut onto the material. The focused laser beam is directed at the material, which then either melts, burns, vaporizes away, or is blown away by a jet of gas, leaving an edge with a high-quality surface finish. Industrial laser cutters are used to cut flat-sheet material as well as structural and piping materials.

Methods

There are many different methods in cutting using lasers, with different types used to cut different material. Some of the methods are vaporization, melt and blow, melt blow and burn, thermal stresscracking, scribing, cold cutting and burning stabilized laser cutting.

Vaporization cutting

In vaporization cutting the focused beam heats the surface of the material to boiling point and generates a keyhole. The keyhole leads to a sudden increase in absorptivity quickly deepening the hole. As the hole deepens and the material boils, vapor generated erodes the molten walls blowing ejecta out and further enlarging the hole. Non melting material such as wood, carbon and thermoset plastics are usually cut by this method.

Melt and blow

Melt and blow or fusion cutting uses high-pressure gas to blow molten material from the cutting area, greatly decreasing the power requirement. First the material is heated to melting point then a gas jet blows the molten material out of the kerf avoiding the need to raise the temperature of the material any further. Materials cut with this process are usually metals.

Thermal stress cracking

Brittle materials are particularly sensitive to thermal fracture, a feature exploited in thermal stress cracking. A beam is focused on the surface causing localized heating and thermal expansion. This results in a crack that can then be guided by moving the beam. The crack can be moved in order of m/s. It is usually used in cutting of glass.

Stealth dicing of silicon wafers

The separation of microelectronic chips as prepared in semiconductor device fabrication from silicon wafers may be performed by the so-called stealth dicing process, which operates with a pulsed Nd:YAG laser, the wavelength of which (1064 nm) is well adopted to the electronic band gap of silicon (1.11 eV or 1117 nm).

Reactive cutting

Also called "burning stabilized lasergas cutting", "flame cutting". Reactive cutting is like oxygen torch cutting but with a laser beam as the ignition source. Mostly used for cutting carbon steel in thicknesses over 1 mm. This process can be used to cut very thick steel plates with relatively little laser power.

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